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The Resource Microvias : for low cost, high density interconnects, John H. Lau, S.W. Ricky Lee

Microvias : for low cost, high density interconnects, John H. Lau, S.W. Ricky Lee

Label
Microvias : for low cost, high density interconnects
Title
Microvias
Title remainder
for low cost, high density interconnects
Statement of responsibility
John H. Lau, S.W. Ricky Lee
Creator
Contributor
Subject
Language
eng
Cataloging source
DLC
Dewey number
621.381/046
Illustrations
illustrations
Index
index present
LC call number
TK7874
LC item number
.L31684 2001
Literary form
non fiction
Nature of contents
bibliography
Series statement
McGraw-Hill professional engineering
Label
Microvias : for low cost, high density interconnects, John H. Lau, S.W. Ricky Lee
Instantiates
Publication
Bibliography note
Includes bibliographical references and index
Carrier category
volume
Carrier MARC source
rdacarrier
Content category
text
Content type MARC source
rdacontent
Dimensions
24 cm.
Extent
xxiii, 565 p.
Isbn
9780071363273
Lccn
2001030752
Media category
unmediated
Media MARC source
rdamedia
Other physical details
ill.
System control number
(OCoLC)ocn370423610
Label
Microvias : for low cost, high density interconnects, John H. Lau, S.W. Ricky Lee
Publication
Bibliography note
Includes bibliographical references and index
Carrier category
volume
Carrier MARC source
rdacarrier
Content category
text
Content type MARC source
rdacontent
Dimensions
24 cm.
Extent
xxiii, 565 p.
Isbn
9780071363273
Lccn
2001030752
Media category
unmediated
Media MARC source
rdamedia
Other physical details
ill.
System control number
(OCoLC)ocn370423610

Library Locations

    • Harold B. Lee Library Brigham Young University, Provo, UT, 84602, US
      40.249156 -111.649242
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